Photoneece^™
Semicofine^™

Photoneece™ Semicofine™ is a polyimide material that combines flexibility with excellent heat resistance, insulation and adhesion with resin. This material prevents cracking and wiring misalignment caused by the difference in thermal expansion coefficient between the mold resin and the semiconductor chip, and also acts as an insulating film on the chip surface, contributing to the reliability of power semiconductors and other devices used in high-temperature and high-voltage environments.

As semiconductor packages become smaller and more integrated, insulating materials that are capable of fine-scale processing and have excellent mechanical properties are required. Photoneece™ is used as a material for the redistribution layer in wafer-level packaging rewiring layer as, in addition to the high heat resistance, insulation and chemical resistance of polyimide, it also provides the micro-fabrication, low-temperature curing, and high adhesion to package-sealing resin and copper that is particularly important for FO-WLP (Fan-Out Wafer Level Package).

The adoption of hollow-structure electronic components, such as MEMS sensors and RF devices now seeing growing use in automotive application, continues to rise. Polyimide materials with excellent mechanical properties are suitable for the formation of these hollow structures, and Photoneece™, which allows for thick film formation, is used as pillar materials in hollow structures. It is also used as an interlayer insulating film in electronic components such as inductors, contributing to realizing highly reliable, high-performance electronic devices.